Wireless

Siemens AG and Palo Alto Networks unveiled a verified cybersecurity solution for industrial private 5G preserving low-latency performance.

Huawei unveiled AI-Powered Green Site and GW-level AIDC solutions to support zero-carbon target networks and AI computing in the ERA.

Fibocom and MediaTek unveiled a CPE design at MWC 2026 combining Fibocom's FG390 5G module with MediaTek's Filogic 8800 Wi‑Fi 8 chipset.

Huawei released the Fully Connected Industrial Networks report at MWC Barcelona and demonstrated smart factory solutions.

Weekly roundup of AI-native wireless and RAN updates, observability and validation releases, and cloud security integrations and threat reporting.

NVIDIA formed a collaboration with Nokia, Ericsson, T-Mobile and Deutsche Telekom to architect AI-native wireless infrastructure.

Ericsson joined the OCUDU Ecosystem Foundation as a founding premier member and took a board seat.

NVIDIA committed with major operators and vendors to develop AI-native, open and secure 6G platforms.

Ericsson completed a pre-standard 6G over-the-air session in Plano, demonstrating cloud-hosted LLM processing, robotics control and real-time video streaming.

Ceragon will exhibit its microwave and mmWave portfolio and the IP-100FR2 at Mobile World Congress 2026.

Join Digital partnered with Connex to expand distribution of its Graphite platform across Asia-Pacific.

Broadcom Inc. introduced an 802.11bn Wi‑Fi 8 AP and Trident X3+ switch with a unified architecture; it was sampling to early access customers.