High performance computing (HPC)

Lam Research Corporation and CEA-Leti announced a multi-year agreement to develop materials and processes for Specialty Technology devices.

Microsoft Corp. partnered with Mercedes-AMG PETRONAS F1 Team to integrate Azure, AI, GitHub and Microsoft 365 into team operations.

AMD opened CES 2026 with an AI-produced, nine-screen immersive keynote and a presentation by CEO Lisa Su.

Vertiv introduced new MegaMod HDX configurations to support high-density AI and HPC compute with modular power and cooling.

GIGABYTE said it achieved DDR5-7200 at full 256GB using CQDIMM support and BIOS tuning, shown at CES 2026.

NVIDIA's Taylor Allison explains how modern network fabrics support large-scale AI workloads and data center GPU clusters.

Super Micro Computer, Inc. showcased new AI desktop, edge, and consumer platforms powered by NVIDIA, Intel, and AMD in Las Vegas.

AMD and HPE announced expanded collaboration on the open AMD “Helios” rack-scale AI platform incorporating HPE Juniper Networking switches and Broadcom technology for AI clusters. HPE will offer this architecture globally in 2026. The Herder supercomputer at HLRS Germany will use AMD and HPE systems for HPC and AI workloads.

Dell'Oro analysts assess optical circuit switches as a power-efficient solution for connecting large-scale AI GPU clusters.

Celestica integrated its Ethernet switches with Aviz Networks' software stack, offering SONiC solutions backed by continuous SLA support.

ONES 3.1 provides unified real-time telemetry across compute, storage, and network components for multi-vendor AI and HPC environments.

ONES and NVIDIA Spectrum-X provide automated orchestration for scalable AI fabrics from setup to operations in GPU clusters.