LAM Research Corporation partners with CEA-Leti on specialty device materials research

Local Autonomy Module (LAM) Research Corporation and CEA-Leti announced a multi-year agreement to accelerate pathfinding of new materials and fabrication processes intended to support the production of more energy-efficient Specialty Technology devices.

The companies described plans to identify and overcome critical materials and engineering challenges and to accelerate optimization of new fabrication solutions for future generations of Specialty Technology devices for Artificial Intelligence (AI) and High performance computing (HPC).

The research paired LAM's etch and deposition technologies, including the pulsed laser deposition system LAM Prestis™, with CEA-Leti's materials analysis, surface science, and device characterization and measurement capabilities, and targeted device classes named in the agreement such as Microgrid Energy Management System (MEMS), 3D imaging and sensors, power management and RF, photonics including MicroLED display applications, and optical interconnect technologies.

Under the agreement, the parties planned to explore novel multi-elemental materials and pathfinding for higher-efficiency compound semiconductors, build on prior co-development work including pulsed plasma technologies, and focus on materials and films for lower-power, high-performance applications intended for next-generation RF filters, electro-optic modulation, and quantum optics.

“By rapidly characterizing how new materials behave in complex device structures, we can pinpoint critical integration challenges and provide Lam with actionable feedback,” said Sébastian Dauvé, CEO of CEA-Leti.

The press release included forward-looking statements based on the current expectations of LAM and CEA-Leti and noted those statements were subject to change under the safe harbor provisions and other risks described in the release.