Vertiv introduces new MegaMod HDX configurations

Vertiv introduced new configurations of the Vertiv MegaMod HDX, a prefabricated power and liquid-cooling module designed to address high-density compute requirements tied to Artificial Intelligence (AI) and High performance computing (HPC) deployments.

The company said the new configurations gave operators greater flexibility to respond to rapidly increasing power and cooling demands while optimizing space and deployment speed, and that the models were available globally.

The MegaMod HDX combined direct-to-chip liquid cooling with air-cooled architectures and supported pod-style AI environments and Graphics Processing Unit (GPU) clusters; a compact module featured a standard height with up to 13 racks and 1.25 Megawatt (MW) capacity, while an extended-height combo supported up to 144 racks and 10 MW, with both supporting rack densities from 50 kW to more than 100 kW per rack.

Vertiv described hybrid cooling architectures that integrated direct-to-chip liquid cooling with Adaptive Incident Response (AIR) systems, and detailed distributed redundant power architecture and a buffer-tank thermal backup system; the company also cited factory-integrated, prefabricated modular designs intended to enable repeatable deployment and cost certainty.

“Today's AI workloads demand cooling solutions that go beyond traditional approaches. With the Vertiv MegaMod HDX available in both compact and combo solution configurations, organizations can match their facility requirements while supporting high-density, liquid-cooled environments at scale. Our designs deliver what data centers need most—reliable performance, operational efficiency, and the ability to scale their AI infrastructure with confidence,” said Viktor Petik, senior vice president, infrastructure solutions at Vertiv.

The release contained forward-looking statements and noted that actual events or results may differ materially and that Vertiv was under no obligation to update or alter those statements.