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Advantech Co., Ltd. introduces edge AI compute products

Source Decision Insights Record Published December 31, 2025 Companies 3
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3 companies named across 9 categories, one of 26 articles referencing Advantech. Previous coverage: Advantech partners with DEEPX on EAI-1961 edge AI module (Dec 2025).

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Advantech Co., Ltd. introduced a new suite of edge Artificial Intelligence (AI) compute products built on Qualcomm Dragonwing IQ‑X to address the requirements of modern industrial applications.

The company said the products were engineered to meet demanding requirements by combining processing capacity, AI acceleration, and advanced wireless connectivity, and that they supported data‑intensive AI applications and robust remote operations with uninterrupted data streaming and real‑time communication in industrial settings.

The devices used Dragonwing IQ‑X platforms with 12‑core and 10‑core Oryon CPUs reaching up to 3.4GHz, and they integrated Qualcomm Hexagon NPUs providing up to 45 TOPS; LPDDR5X memory RAN at 8533MT/s versus 6400MT/s, and UFS 3.1 Gear 4 storage raised transfer rates from 1,000Mbps (PCIe Gen3 Non-volatile Memory Express (NVME)) to 16,000Mbps while UFS 4.0 options were available.

Graphics and multimedia capabilities included a Snapdragon Adreno 5th Generation VPU with 4K60p full‑duplex H.264 encode/decode and an Adreno Graphics Processing Unit (GPU) compatible with OpenCL, OpenGL, and Microsoft DirectX 12, and the platforms incorporated integrated Wi‑Fi 7 (802.11be) and 5G connectivity.

Advantech released three models—the AOM‑6731 AI module, the AIMB‑293 Mini‑ITX motherboard, and the SOM‑6820 COM Express Type 6 module—made samples of the AOM‑6731 and SOM‑6820 available, and said the AIMB‑293 would be open for engineering evaluations beginning in March 2026.

Press release, provided by Cision on behalf of Advantech. Read the original.

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