Micron demonstrates 512GB DDR5 RDIMM for server platforms
2 companies named across 3 categories, one of 110 articles referencing AMD. Previous coverage: ABI Research Says Confidential AI Expands From CPUs to GPUs (Sep 2026).
Companies mentioned
Best suited for
- Seniority
- EVP / SVP / VP / AVP
- Job function
- Chief Technology Officer
- Persona
- Platform / Infrastructure Architect
- Buyer role
- Decision Maker / Budget Holder
- Buyer journey
- Need to Buy
- Adoption curve
- Early Adopters
- Technology maturity
- Market Correction
- Industry
- Data Center / AI Data Center / NeoCloud
Our classification, not the publisher's statement. Best suited for, not only for.
Micron Technology, Inc. demonstrated a 512GB DDR5 RDIMM on multiple server platforms, targeting higher capacity in server memory and a stated reduction in operating power. The company said the module is designed for environments that rely on large memory footprints and frequent data access.
Micron said its packaging approach supports modern server architectures by increasing DRAM density within a DRAM package. It also stated the module enables up to 12TB of DDR5 DRAM in a single 24-slot dual-socket server. The company said AMD and Intel were validating the module.
Micron attributed the high capacity to advanced vertical interconnect packaging, including vertically stacking DRAM dies interconnected by through-silicon vias (TSVs). The 512GB RDIMM was demonstrated with speeds up to 9,200 MT/s. Micron also said the module reduces operating power by more than 60% compared with four 128GB RDIMMs, and cited a 16.0W power figure for one 512GB module versus 44.2W total for four 128GB modules.
Micron collaborated with ecosystem partners to validate the 512GB DDR5 RDIMM across next-generation server platforms, and it said volume production is expected in the second half of 2027. “Micron continues to set the pace for memory technology, delivering a new class of ultra-dense, high-performance server memory that helps customers keep larger datasets closer to the compute engines that need them,” said Raj Narasimhan, senior vice president and general manager of the Cloud Memory Business Unit at Micron. “AMD solutions continue to advance data center performance, scalability and efficiency as AI and data-intensive workloads reshape infrastructure requirements,” said Amit Goel, corporate vice president, Compute and Enterprise AI Platform Solutions Engineering, AMD. “Intel is working closely with Micron to validate its 512GB DDR5 RDIMM and help enable future server platforms designed to meet the growing demands of next-generation data center workloads,” said Karin Eibschitz Segal, general manager of platform and system engineering in Intel’s Data Center Group.
Press release, provided by Globe Newswire on behalf of Micron Technology Inc. Read the original.