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Applied Materials and Besi Expand Partnership via EPIC Center

Source Decision Insights Record Published October 1, 2026 Companies 2
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2 companies named across 2 categories, one of 28 articles referencing Applied Materials. Previous coverage: Enterprise switching forecasts, AI infrastructure funding, and data security tool sprawl - Week of August 17, 2026 (Aug 2026).

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Applied Materials and BE Semiconductor Industries N.V. expanded their strategic partnership, with Besi joining Applied’s EPIC (Equipment and Process Innovation and Commercialization) Center as an Innovation Partner. The companies said the expanded collaboration extends the work they began in 2020 into a broader set of interconnect and integration technologies.

Applied and Besi based the expansion on their joint development program launched in 2020, including a Center of Excellence in Singapore. The companies described the next phase as focused on co-developed process and assembly work across an advanced packaging flow.

The collaboration builds on prior work in hybrid bonding and interconnect architectures. The scope described in the announcement included next-generation 3D IC scaling and logic and memory integration, along with photonics-enabled interconnect applications supporting co-packaged optics and AI system scaling. Expected R&D programs included new platforms for die-to-wafer hybrid bonding, scaling thermo-compression bonding (TCB), and die-on-wafer, die-on-die, and die-on-panel integration platforms.

As an Innovation Partner, Besi engineers work alongside Applied’s EPIC Center teams to support joint development across the expanded technology set. The companies cited Applied’s new $5 billion EPIC Center in Silicon Valley, which they said was designed for R&D commercialization from early-stage research to full-scale manufacturing and was operationally ready this year.

“Besi has been a trusted partner since we began co-developing next-generation hybrid bonding solutions,” said Gary Dickerson, President and CEO of Applied Materials. “With Besi joining EPIC as an Innovation Partner, we’re extending that collaboration across the interconnect technologies our customers need to scale AI systems. Bringing this work into Applied’s EPIC Center gives both companies earlier visibility into where the roadmap is headed and lets us co-optimize the full packaging flow.”

“Our center of excellence with Applied in Singapore has been foundational to Besi's hybrid bonding roadmap,” said Richard Blickman, CEO and Chairman of the Board of Management of Besi. “Joining Applied's EPIC Center as an Innovation Partner is a natural next step, giving us a seat alongside the leading logic, memory and systems companies as we advance TCB scaling, die-on-panel integration and the interconnect technologies that will define the next generation of AI and photonics systems”

Forward-looking statements in the announcement addressed expectations for EPIC Center investment and plans, the development of new materials and technologies, and risks and uncertainties that could affect results.

Press release, provided by Globe Newswire on behalf of Applied Materials. Read the original.

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