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Applied Materials and Intel Collaborate on EPIC Center Work

Source Decision Insights Record Published October 6, 2026 Companies 3
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3 companies named across 2 categories, one of 29 articles referencing Applied Materials. Previous coverage: Applied Materials and Besi Expand Partnership via EPIC Center (Oct 2026).

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Applied Materials Inc. worked with Intel Corporation on chipmaking research spanning next-generation transistors, interconnects, and advanced packaging, with activity centered on Applied’s EPIC Center and Intel’s R&D campus. The companies said the effort aimed to reduce the time needed to develop semiconductor technologies used for AI computing.

Applied described the collaboration as an extension of its long history with Intel on semiconductor device scaling challenges. The companies also tied the work to their focus on materials, process technologies, and device architectures for advanced logic nodes targeting AI workloads.

Under the collaboration, teams from Applied Materials and Intel worked on next-generation materials, process technologies, and device architectures, and continued work at the EPIC Center. The scope included both front-end and back-end-of-line advancements, including interconnect scaling, along with advanced packaging technologies for Foveros-based 3D stacking intended to increase interconnect density, improve power delivery, and enhance thermal performance for high-performance compute platforms designed to accelerate emerging agentic AI workloads.

Applied said it built a new EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley, scheduled to be operationally ready this year. The center was described as a setting for earlier access to Applied’s R&D portfolio, faster cycles of learning, and accelerated transfer of next-generation technologies into high-volume manufacturing within a secure collaborative environment. The organizations also described co-innovation programs at the EPIC Center as providing multi-node visibility to guide R&D investments.

“Applied and Intel share a decades-long history of deep collaboration focused on pushing the boundaries of materials engineering to advance the semiconductor roadmap,” said Gary Dickerson, President and CEO of Applied Materials. “Bringing our teams together at the EPIC Center will deepen that partnership and accelerate the transistor, interconnect and packaging innovations needed to drive the future of AI computing.”

“The demand for AI computing is driving the need for major advances in performance, power efficiency, and packaging. Intel is focused on delivering those innovations and doing it in close collaboration with partners across the ecosystem,” said Lip-Bu Tan, CEO of Intel. “Applied Materials is an important partner, and we look forward to expanding our work together at the EPIC Center to help accelerate the path from the lab to high-volume manufacturing in the United States.”

Forward-looking statements in the release addressed plans and expectations for the EPIC Center and the development of new materials and technologies.

Press release, provided by Globe Newswire on behalf of Applied Materials. Read the original.

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