Signal
The full archive of enterprise technology signals: launches, funding, partnerships, advisories, and market moves across cloud, networking, cybersecurity, and AI.
The full archive of enterprise technology signals: launches, funding, partnerships, advisories, and market moves across cloud, networking, cybersecurity, and AI.
Decision Insights Editorial • May 4, 2026
Capgemini’s 2026 World P&C Insurance report says 10% of insurers have scaled AI and are seeing higher revenue growth and share price gains. It cites gaps in AI metrics, unclear ROI ownership, skills shortages, and limited workday change despite tool access, contrasting “intelligence trailblazers” with the exploration-stage majority.
Decision Insights Editorial • May 4, 2026
On May 5-6, 2026 the Wireless Infrastructure Association (WIA) will host esteemed keynote panelists for Connect (X) 2026 – the only digital infrastructure event in North America uniting the entire connectivity The post Connect (X) Keynotes: NVIDIA, Nokia, Ericsson, T-Mobile, American Tower, Intel, JLL, Qualcomm appeared first on Wireless Infrastructure Association.
Decision Insights Editorial • May 4, 2026
Recorded Future says it was named a Leader in the 2026 Gartner Magic Quadrant for Cyberthreat Intelligence Technologies, citing its “intelligence-first” platform approach. The release includes CEO commentary, Gartner evaluation criteria (Ability to Execute and Completeness of Vision), company scale claims, and a Mastercard acquisition note.
Decision Insights Editorial • May 4, 2026
ASUS released its 2026 Future of SMB Report, citing AI readiness at 47% of US SMBs and 68% reporting productivity gains.
Decision Insights Editorial • May 4, 2026
Tencent’s Weixin 2025 Brand Protection Report cites AI detection, user reports, and brand partnership outcomes, including $430M+ recovered enforcement value.
Decision Insights Editorial • May 3, 2026
Applied Materials agreed to acquire ASMPT’s NEXX business to expand its panel-level advanced packaging portfolio. The deal adds NEXX’s panel-level electrochemical deposition (ECD) technology to support scaling AI chiplets to larger interposers and panel substrates, with transaction close expected within months.