Term · Topic

Through-Silicon Via (TSV)

Q: What is Through-Silicon Via?

Through-Silicon Via (TSV) is a vertical electrical interconnect that passes completely through a silicon DIE to provide direct chip-to-chip or die-to-wafer connections in three-dimensional integrated circuits and advanced packaging. Expanded Explanation 1. Technical Function and Core Characteristics Through-silicon vias are cylindrical or tapered holes etched through a silicon substrate and filled or lined with conductive materials such as copper or tungsten to create vertical signal, power, or

Through-silicon via (TSV) is a vertical electrical interconnect that passes through a silicon die to link stacked chips in three-dimensional integrated circuits, relevant to enterprises that rely on high-bandwidth memory, dense packaging, and compact, power-efficient compute hardware.

What this term record gives an agent

Vendors describe the same technology in different words. This record pins down what "TSV" means and ties it to the companies and coverage that use it, so an agent compares like with like.

One definition

A plain definition plus how it's used, what it's often confused with and why it matters.

Neighboring terms

Related terms in the same glossary, so an agent can widen or narrow a search the way the market does.

Get this term

The same record, four ways in. No key needed to try it.

MCP

curl -X POST https://mcp.decisioninsights.ai/api/mcp-public \
  -H "content-type: application/json" \
  -H "accept: application/json, text/event-stream" \
  -d '{"id":1,"jsonrpc":"2.0","method":"tools/call","params":{"arguments":{"slug":"through-silicon-via-tsv"},"name":"di_get_term"}}'

REST

GET https://api.decisioninsights.ai/api/public/v1/glossary/5827ea13-d5f8-4cd5-ac1a-294ef6fca2c9

CLI

di get-glossary --slug through-silicon-via-tsv

JSON-LD

The schema.org markup this page publishes for search engines and AI agents, exactly as they read it.

[
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/#website",
    "@type": "WebSite",
    "name": "Decision Insights",
    "potentialAction": {
      "@type": "SearchAction",
      "target": {
        "@type": "EntryPoint",
        "urlTemplate": "https://decisioninsights.ai/search/?q={search_term_string}&submit=1"
      }
    },
    "publisher": {
      "@id": "https://decisioninsights.ai/#organization"
    },
    "url": "https://decisioninsights.ai"
  },
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/#organization",
    "@type": "Organization",
    "contactPoint": {
      "@type": "ContactPoint",
      "contactType": "customer support",
      "email": "[email protected]"
    },
    "description": "Decision Insights is a Registry of technology companies, open source projects, and industry terms, built for people and for AI agents that need sourced, structured information.",
    "legalName": "Wiretap Labs, LLC",
    "logo": {
      "@type": "ImageObject",
      "url": "https://wiretap-cdn-assets.nyc3.cdn.digitaloceanspaces.com/decision-insights/[email protected]"
    },
    "name": "Decision Insights",
    "parentOrganization": {
      "@type": "Organization",
      "name": "Wiretap Labs",
      "sameAs": [
        "https://www.linkedin.com/company/wiretap-labs",
        "https://www.crunchbase.com/organization/wiretap-labs"
      ],
      "url": "https://wiretaplabs.com"
    },
    "publishingPrinciples": "https://decisioninsights.ai/standards/",
    "sameAs": [
      "https://www.linkedin.com/company/decisioninsights"
    ],
    "url": "https://decisioninsights.ai"
  },
  {
    "@context": "https://schema.org",
    "@type": "BreadcrumbList",
    "itemListElement": [
      {
        "@type": "ListItem",
        "item": "https://decisioninsights.ai",
        "name": "Decision Insights",
        "position": 1
      },
      {
        "@type": "ListItem",
        "item": "https://decisioninsights.ai/term/",
        "name": "Glossary",
        "position": 2
      },
      {
        "@type": "ListItem",
        "item": "https://decisioninsights.ai/term/through-silicon-via-tsv/",
        "name": "Through-Silicon Via",
        "position": 3
      }
    ]
  },
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/term/through-silicon-via-tsv/#definedterm",
    "@type": "DefinedTerm",
    "additionalProperty": [
      {
        "@type": "PropertyValue",
        "name": "Related terms",
        "valueReference": [
          {
            "@id": "https://decisioninsights.ai/term/silicon-interposer/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/silicon-interposer/",
            "name": "Silicon Interposer"
          },
          {
            "@id": "https://decisioninsights.ai/term/die-to-die-interconnect/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/die-to-die-interconnect/",
            "name": "Die-to-Die Interconnect"
          },
          {
            "@id": "https://decisioninsights.ai/term/interposer-technology/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/interposer-technology/",
            "name": "Interposer Technology"
          },
          {
            "@id": "https://decisioninsights.ai/term/silicon-bridge/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/silicon-bridge/",
            "name": "Silicon Bridge"
          },
          {
            "@id": "https://decisioninsights.ai/term/disaggregated-silicon/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/disaggregated-silicon/",
            "name": "Disaggregated Silicon"
          },
          {
            "@id": "https://decisioninsights.ai/term/chip-to-chip-interconnect/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/chip-to-chip-interconnect/",
            "name": "Chip-to-Chip Interconnect"
          },
          {
            "@id": "https://decisioninsights.ai/term/interposer/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/interposer/",
            "name": "Interposer"
          },
          {
            "@id": "https://decisioninsights.ai/term/wafer-scale-integration-wsi/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/wafer-scale-integration-wsi/",
            "name": "Wafer-Scale Integration"
          }
        ]
      }
    ],
    "description": "Through-silicon via (TSV) is a vertical electrical interconnect that passes through a silicon die to link stacked chips in three-dimensional integrated circuits, relevant to enterprises that rely on high-bandwidth memory, dense packaging, and compact, power-efficient compute hardware.",
    "inDefinedTermSet": {
      "@id": "https://decisioninsights.ai/term/#termset",
      "@type": "DefinedTermSet",
      "url": "https://decisioninsights.ai/term/"
    },
    "name": "Through-Silicon Via",
    "termCode": "TSV",
    "url": "https://decisioninsights.ai/term/through-silicon-via-tsv/"
  },
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/term/through-silicon-via-tsv/",
    "@type": "CollectionPage",
    "dateModified": "2026-08-24T01:27:10Z",
    "description": "Through-silicon via (TSV) is a vertical electrical interconnect that passes through a silicon die to link stacked chips in three-dimensional integrated circuits, relevant to enterprises that rely on high-bandwidth memory, dense packaging, and compact, power-efficient compute hardware.",
    "isPartOf": {
      "@id": "https://decisioninsights.ai/#website"
    },
    "mainEntity": {
      "@id": "https://decisioninsights.ai/term/through-silicon-via-tsv/#definedterm"
    },
    "name": "Through-Silicon Via",
    "sdDatePublished": "2026-08-24",
    "sdPublisher": {
      "@id": "https://decisioninsights.ai/#organization"
    },
    "url": "https://decisioninsights.ai/term/through-silicon-via-tsv/"
  },
  {
    "@context": "https://schema.org",
    "@type": "FAQPage",
    "mainEntity": [
      {
        "@type": "Question",
        "acceptedAnswer": {
          "@type": "Answer",
          "text": "Through-Silicon Via (TSV) is a vertical electrical interconnect that passes completely through a silicon DIE to provide direct chip-to-chip or die-to-wafer connections in three-dimensional integrated circuits and advanced packaging.\nExpanded Explanation\n1. Technical Function and Core Characteristics\nThrough-silicon vias are cylindrical or tapered holes etched through a silicon substrate and filled or lined with conductive materials such as copper or tungsten to create vertical signal, power, or"
        },
        "name": "What is Through-Silicon Via?"
      }
    ]
  }
]

Is this your company? Get structured data for your own pages

The CLI command and the REST call for this record need a free account: run di login, or send your OAuth token. Over MCP it is free with none.

Connect your agent (MCP) REST API and CLI docs

How an agent can rely on this definition

What the record lets an agent check before it uses the term in an answer.

The check	What the record shows	Where it is in the data
It's a known term	One entry, with its abbreviation and type (topic)	`name, alternateName`
It sits in a glossary	Linked to Silicon Interposer, Die-to-Die Interconnect, Interposer Technology, Silicon Bridge	`inDefinedTermSet`

View the raw record (JSON-LD)

[
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/#website",
    "@type": "WebSite",
    "name": "Decision Insights",
    "potentialAction": {
      "@type": "SearchAction",
      "target": {
        "@type": "EntryPoint",
        "urlTemplate": "https://decisioninsights.ai/search/?q={search_term_string}&submit=1"
      }
    },
    "publisher": {
      "@id": "https://decisioninsights.ai/#organization"
    },
    "url": "https://decisioninsights.ai"
  },
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/#organization",
    "@type": "Organization",
    "contactPoint": {
      "@type": "ContactPoint",
      "contactType": "customer support",
      "email": "[email protected]"
    },
    "description": "Decision Insights is a Registry of technology companies, open source projects, and industry terms, built for people and for AI agents that need sourced, structured information.",
    "legalName": "Wiretap Labs, LLC",
    "logo": {
      "@type": "ImageObject",
      "url": "https://wiretap-cdn-assets.nyc3.cdn.digitaloceanspaces.com/decision-insights/[email protected]"
    },
    "name": "Decision Insights",
    "parentOrganization": {
      "@type": "Organization",
      "name": "Wiretap Labs",
      "sameAs": [
        "https://www.linkedin.com/company/wiretap-labs",
        "https://www.crunchbase.com/organization/wiretap-labs"
      ],
      "url": "https://wiretaplabs.com"
    },
    "publishingPrinciples": "https://decisioninsights.ai/standards/",
    "sameAs": [
      "https://www.linkedin.com/company/decisioninsights"
    ],
    "url": "https://decisioninsights.ai"
  },
  {
    "@context": "https://schema.org",
    "@type": "BreadcrumbList",
    "itemListElement": [
      {
        "@type": "ListItem",
        "item": "https://decisioninsights.ai",
        "name": "Decision Insights",
        "position": 1
      },
      {
        "@type": "ListItem",
        "item": "https://decisioninsights.ai/term/",
        "name": "Glossary",
        "position": 2
      },
      {
        "@type": "ListItem",
        "item": "https://decisioninsights.ai/term/through-silicon-via-tsv/",
        "name": "Through-Silicon Via",
        "position": 3
      }
    ]
  },
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/term/through-silicon-via-tsv/#definedterm",
    "@type": "DefinedTerm",
    "additionalProperty": [
      {
        "@type": "PropertyValue",
        "name": "Related terms",
        "valueReference": [
          {
            "@id": "https://decisioninsights.ai/term/silicon-interposer/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/silicon-interposer/",
            "name": "Silicon Interposer"
          },
          {
            "@id": "https://decisioninsights.ai/term/die-to-die-interconnect/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/die-to-die-interconnect/",
            "name": "Die-to-Die Interconnect"
          },
          {
            "@id": "https://decisioninsights.ai/term/interposer-technology/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/interposer-technology/",
            "name": "Interposer Technology"
          },
          {
            "@id": "https://decisioninsights.ai/term/silicon-bridge/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/silicon-bridge/",
            "name": "Silicon Bridge"
          },
          {
            "@id": "https://decisioninsights.ai/term/disaggregated-silicon/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/disaggregated-silicon/",
            "name": "Disaggregated Silicon"
          },
          {
            "@id": "https://decisioninsights.ai/term/chip-to-chip-interconnect/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/chip-to-chip-interconnect/",
            "name": "Chip-to-Chip Interconnect"
          },
          {
            "@id": "https://decisioninsights.ai/term/interposer/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/interposer/",
            "name": "Interposer"
          },
          {
            "@id": "https://decisioninsights.ai/term/wafer-scale-integration-wsi/#definedterm",
            "@type": "DefinedTerm",
            "mainEntityOfPage": "https://decisioninsights.ai/term/wafer-scale-integration-wsi/",
            "name": "Wafer-Scale Integration"
          }
        ]
      }
    ],
    "description": "Through-silicon via (TSV) is a vertical electrical interconnect that passes through a silicon die to link stacked chips in three-dimensional integrated circuits, relevant to enterprises that rely on high-bandwidth memory, dense packaging, and compact, power-efficient compute hardware.",
    "inDefinedTermSet": {
      "@id": "https://decisioninsights.ai/term/#termset",
      "@type": "DefinedTermSet",
      "url": "https://decisioninsights.ai/term/"
    },
    "name": "Through-Silicon Via",
    "termCode": "TSV",
    "url": "https://decisioninsights.ai/term/through-silicon-via-tsv/"
  },
  {
    "@context": "https://schema.org",
    "@id": "https://decisioninsights.ai/term/through-silicon-via-tsv/",
    "@type": "CollectionPage",
    "dateModified": "2026-08-24T01:27:10Z",
    "description": "Through-silicon via (TSV) is a vertical electrical interconnect that passes through a silicon die to link stacked chips in three-dimensional integrated circuits, relevant to enterprises that rely on high-bandwidth memory, dense packaging, and compact, power-efficient compute hardware.",
    "isPartOf": {
      "@id": "https://decisioninsights.ai/#website"
    },
    "mainEntity": {
      "@id": "https://decisioninsights.ai/term/through-silicon-via-tsv/#definedterm"
    },
    "name": "Through-Silicon Via",
    "sdDatePublished": "2026-08-24",
    "sdPublisher": {
      "@id": "https://decisioninsights.ai/#organization"
    },
    "url": "https://decisioninsights.ai/term/through-silicon-via-tsv/"
  },
  {
    "@context": "https://schema.org",
    "@type": "FAQPage",
    "mainEntity": [
      {
        "@type": "Question",
        "acceptedAnswer": {
          "@type": "Answer",
          "text": "Through-Silicon Via (TSV) is a vertical electrical interconnect that passes completely through a silicon DIE to provide direct chip-to-chip or die-to-wafer connections in three-dimensional integrated circuits and advanced packaging.\nExpanded Explanation\n1. Technical Function and Core Characteristics\nThrough-silicon vias are cylindrical or tapered holes etched through a silicon substrate and filled or lined with conductive materials such as copper or tungsten to create vertical signal, power, or"
        },
        "name": "What is Through-Silicon Via?"
      }
    ]
  }
]