Silicon

SEALSQ said it is building a “Root-to-Qubit” quantum stack through investments and acquisitions across quantum computing companies, anchored by QS7001 and QVault TPM.

NVIDIA introduced new DOCA security capabilities for Vera BlueField-4 STX to enforce zero-trust file access and policy controls in silicon.

Dell’Oro Group says 6G RAN planning is shifting to evolutionary deployments, AI-native RAN, open fronthaul, and economics as key focus areas.

Weekly roundup covering exploit telemetry automation, AI governance integrations, telco network modernization, and microsegmentation forecasts.

Applied Materials said SCREEN Semiconductor Solutions joined its EPIC Center to co-develop co-optimized wafer cleaning and surface preparation processes.

Diraq signed a Letter of Intent with the U.S. Department of Commerce for up to $38 million to scale silicon-based quantum processors.

Applied Materials said Broadcom will join its EPIC platform as an innovation partner for advanced chip packaging R&D.

Most AI discussions start at the app layer, but this post says network standardization affects GPU utilization and AI serving costs.

SEALSQ said Anthropic’s Claude Mythos Preview raised cybersecurity risks and that it wants PQC embedded in semiconductor hardware.

ABI Research named QNX, Wind River, SYSGO and Green Hills Software Leaders in its Commercial RTOS for Robotics Functional Safety ranking.

Applied Materials said Advantest will join the EPIC platform as an innovation partner, co-locating Advantest’s new testing-focused Innovation Center with Applied’s EPIC Center in Silicon Valley. The effort targets links between semiconductor front-end manufacturing and back-end testing for chips and advanced packaging, with the facilities planned to be operational in 2026.

Molex agreed to acquire Teramount to add TeraVERSE detachable fiber-to-chip connectivity for high-volume co-packaged optics, with 1H 2026 closing expected.