What is Multi-Chip Module?

A Multi-Chip Module (MCM) is a single electronic package that integrates multiple integrated circuit dies or chips on a common substrate or interposer to function as a unified component. Expanded Explanation 1. Technical Function and Core Characteristics A MCM integrates two or more bare dies, memory chips, or other components onto a shared substrate that provides power distribution, signal routing, and thermal paths. The package presents itself to a board as one component with defined

How widely is Multi-Chip Module used?

2 organizations in our directory are tagged Multi-Chip Module, referenced across 1 article and 1 open source project.

What is Multi-Chip Module most closely associated with?

Multi-Chip Module is most closely associated with Edge Resource Allocator and Internet of Things.

Multi-Chip Module (MCM)

Last updated August 24, 2026

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The record

This is what the machine sees: the exact JSON-LD an agent receives for this listing.

WebSite

{
  "@context": "https://schema.org",
  "@id": "https://decisioninsights.ai/#website",
  "@type": "WebSite",
  "name": "Decision Insights",
  "potentialAction": {
    "@type": "SearchAction",
    "target": {
      "@type": "EntryPoint",
      "urlTemplate": "https://decisioninsights.ai/search/?q={search_term_string}\u0026submit=1"
    }
  },
  "publisher": {
    "@id": "https://decisioninsights.ai/#organization"
  },
  "url": "https://decisioninsights.ai"
}

Organization

{
  "@context": "https://schema.org",
  "@id": "https://decisioninsights.ai/#organization",
  "@type": "Organization",
  "contactPoint": {
    "@type": "ContactPoint",
    "contactType": "customer support",
    "email": "[email protected]"
  },
  "description": "Decision Insights is a Registry of technology companies, open source projects, and industry terms, built for people and for AI agents that need sourced, structured information.",
  "logo": {
    "@type": "ImageObject",
    "url": "https://wiretap-cdn-assets.nyc3.cdn.digitaloceanspaces.com/decision-insights/[email protected]"
  },
  "name": "Decision Insights",
  "parentOrganization": {
    "@type": "Organization",
    "name": "Wiretap Labs",
    "sameAs": [
      "https://www.linkedin.com/company/wiretap-labs",
      "https://www.crunchbase.com/organization/wiretap-labs"
    ],
    "url": "https://wiretaplabs.com"
  },
  "publishingPrinciples": "https://decisioninsights.ai/standards/",
  "sameAs": [
    "https://www.linkedin.com/company/decisioninsights"
  ],
  "url": "https://decisioninsights.ai"
}

BreadcrumbList

{
  "@context": "https://schema.org",
  "@type": "BreadcrumbList",
  "itemListElement": [
    {
      "@type": "ListItem",
      "item": "https://decisioninsights.ai",
      "name": "Decision Insights",
      "position": 1
    },
    {
      "@type": "ListItem",
      "item": "https://decisioninsights.ai/term/",
      "name": "Glossary",
      "position": 2
    },
    {
      "@type": "ListItem",
      "item": "https://decisioninsights.ai/term/multi-chip-module-mcm/",
      "name": "Multi-Chip Module",
      "position": 3
    }
  ]
}

DefinedTerm

{
  "@context": "https://schema.org",
  "@id": "https://decisioninsights.ai/term/multi-chip-module-mcm/#definedterm",
  "@type": "DefinedTerm",
  "additionalProperty": [
    {
      "@type": "PropertyValue",
      "name": "Articles mentioning this entity",
      "value": 1
    },
    {
      "@type": "PropertyValue",
      "name": "Open source projects",
      "value": 1
    },
    {
      "@type": "PropertyValue",
      "name": "Organizations tagged",
      "value": 2
    },
    {
      "@type": "PropertyValue",
      "name": "Organizations",
      "propertyID": "https://decisioninsights.ai/ns#taggedOrganizations",
      "value": [
        {
          "@id": "https://decisioninsights.ai/registry/mcm-telecom/#organization",
          "@type": "Organization",
          "mainEntityOfPage": "https://decisioninsights.ai/registry/mcm-telecom/",
          "name": "MCM Telecom"
        },
        {
          "@id": "https://decisioninsights.ai/registry/multikarya-cipta-manunggal-mcm/#organization",
          "@type": "Organization",
          "mainEntityOfPage": "https://decisioninsights.ai/registry/multikarya-cipta-manunggal-mcm/",
          "name": "Multikarya Cipta Manunggal (MCM)"
        }
      ]
    },
    {
      "@type": "PropertyValue",
      "name": "Related terms",
      "valueReference": [
        {
          "@id": "https://decisioninsights.ai/term/chiplet-architecture/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/chiplet-architecture/",
          "name": "Chiplet Architecture"
        },
        {
          "@id": "https://decisioninsights.ai/term/multi-cloud-management-platform-mcmp/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/multi-cloud-management-platform-mcmp/",
          "name": "Multi-Cloud Management Platform"
        },
        {
          "@id": "https://decisioninsights.ai/term/chiplets/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/chiplets/",
          "name": "Chiplets"
        },
        {
          "@id": "https://decisioninsights.ai/term/chip-on-wafer-cow/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/chip-on-wafer-cow/",
          "name": "Chip-on-Wafer"
        },
        {
          "@id": "https://decisioninsights.ai/term/system-on-a-chip/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/system-on-a-chip/",
          "name": "System-on-a-Chip"
        },
        {
          "@id": "https://decisioninsights.ai/term/dual-inline-memory-modules-dimm/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/dual-inline-memory-modules-dimm/",
          "name": "Dual Inline Memory Modules"
        },
        {
          "@id": "https://decisioninsights.ai/term/capacity-expansion-module/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/capacity-expansion-module/",
          "name": "Capacity Expansion Module"
        },
        {
          "@id": "https://decisioninsights.ai/term/high-density-compute-module/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/high-density-compute-module/",
          "name": "High-Density Compute Module"
        }
      ]
    },
    {
      "@type": "PropertyValue",
      "name": "Related terms (co-occurring topics)",
      "valueReference": [
        {
          "@id": "https://decisioninsights.ai/term/edge-resource-allocator-era/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/edge-resource-allocator-era/",
          "name": "Edge Resource Allocator"
        },
        {
          "@id": "https://decisioninsights.ai/term/internet-of-things-iot/#definedterm",
          "@type": "DefinedTerm",
          "mainEntityOfPage": "https://decisioninsights.ai/term/internet-of-things-iot/",
          "name": "Internet of Things"
        }
      ]
    }
  ],
  "description": "Multi-chip module is a packaging approach that combines multiple integrated circuit dies or chips into one component on a shared substrate or interposer. It matters in enterprise hardware because it affects system performance, power, form factor, and lifecycle planning.",
  "inDefinedTermSet": {
    "@id": "https://decisioninsights.ai/term/#termset",
    "@type": "DefinedTermSet",
    "url": "https://decisioninsights.ai/term/"
  },
  "name": "Multi-Chip Module",
  "subjectOf": [
    {
      "@id": "https://decisioninsights.ai/identiv-inc-completes-thailand-manufacturing-transition/#blogposting",
      "@type": "NewsArticle",
      "headline": "Identiv, Inc. completes Thailand manufacturing transition",
      "isBasedOn": {
        "@type": "CreativeWork",
        "sourceOrganization": {
          "@type": "Organization",
          "name": "Cision"
        },
        "url": "https://www.prnewswire.com/news-releases/identiv-completes-thailand-manufacturing-transition-unlocking-next-generation-multicomponent-manufacturing-for-advanced-iot-solutions-302645492.html"
      },
      "url": "https://decisioninsights.ai/identiv-inc-completes-thailand-manufacturing-transition/"
    }
  ],
  "termCode": "MCM",
  "url": "https://decisioninsights.ai/term/multi-chip-module-mcm/"
}

CollectionPage

{
  "@context": "https://schema.org",
  "@id": "https://decisioninsights.ai/term/multi-chip-module-mcm/",
  "@type": "CollectionPage",
  "dateModified": "2026-08-24T03:44:57Z",
  "description": "Multi-chip module is a packaging approach that combines multiple integrated circuit dies or chips into one component on a shared substrate or interposer. It matters in enterprise hardware because it affects system performance, power, form factor, and lifecycle planning.",
  "isPartOf": {
    "@id": "https://decisioninsights.ai/#website"
  },
  "mainEntity": {
    "@id": "https://decisioninsights.ai/term/multi-chip-module-mcm/#definedterm"
  },
  "name": "Multi-Chip Module",
  "sdDatePublished": "2026-08-24",
  "sdPublisher": {
    "@id": "https://decisioninsights.ai/#organization"
  },
  "url": "https://decisioninsights.ai/term/multi-chip-module-mcm/"
}

What we add

Graph

A glossary entry defines a term and stops there. It doesn't show where the term is actually being used or written about. We track and link every article that covers it.

NewsArticle Identiv, Inc. completes Thailand manufacturing transition

Counted facts

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Articles mentioning this entity 1 Open source projects 1 Organizations tagged 2 Organizations MCM Telecom, Multikarya Cipta Manunggal (MCM) Related terms Related terms (co-occurring topics)

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Somebody dispatched this agent to evaluate Multi-Chip Module for a real decision: a shortlist, a vendor comparison, a purchase. "Multi-Chip Module makes X" isn't something they can act on; they need to know the claim is real and where it came from. Follow one enriched link from Act 2 and see what the agent can actually hand back to them:

The record DefinedTerm Multi-Chip Module
One of its 1 linked records NewsArticle Identiv, Inc. completes Thailand manufacturing transition https://decisioninsights.ai/identiv-inc-completes-thailand-manufacturing-transition/
The primary source CreativeWork prnewswire.com https://www.prnewswire.com/news-releases/identiv-completes-thailand-manufacturing-transition-unlocking-next-generation-multicomponent-manufacturing-for-advanced-iot-solutions-302645492.html

Our summary is written by Decision Insights Record. The source keeps its own byline. Both are in the JSON.