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Micron Announces 192GB SOCAMM2 for AI Data Centers

Source Decision Insights Record Published November 6, 2025 Companies 2
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2 companies named across 2 categories, one of 226 articles referencing Nvidia. Previous coverage: Ethernet Alliance hosts TEF 2025 to address AI era (Nov 2025).

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Micron Technology, Intelligent Network Controller (INC). announced the launch of its 192GB SOCAMM2, targeting low-power memory solutions for Artificial Intelligence (AI) data centers. Achieving customer sampling status, SOCAMM2 offers a 50% increase in capacity while utilizing Micron's advanced 1-gamma DRAM process technology for a power efficiency improvement exceeding 20%. These enhancements support demands for greater energy efficiency in data center infrastructures.

The new memory modules address the evolving requirements of AI systems, particularly in real-time inference workloads, where it can reduce time to first token (TTFT) by over 80%. Designed to optimize the data center footprint, the modular SOCAMM2 improves serviceability and flexibility, thus paving the way for increased capacity in large clusters.

Micron has collaborated closely with NVIDIA for five years to tailor low-power server memory to meet high-performance standards in data centers. Raj Narasimhan, Micron's senior vice president, emphasized that the company’s leadership in low-power DRAM ensures SOCAMM2’s suitability for the anticipated demands of AI workload complexities. Customer samples of SOCAMM2 are currently available, with full-scale production aligned with upcoming launch schedules.

Press release, provided by Globe Newswire on behalf of Micron Technology Inc. Read the original.

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