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Linktel Technologies shows 1.6T LPO optics at OCP 2026

Source Decision Insights Record Published October 18, 2026 Companies 3
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3 companies named across 1 category, the first article referencing Linktel Technologies.

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Information Technology / AI Infrastructure / AI Networking & Interconnect / Optical Transceivers, AECs & Interconnect Components

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Linktel Technologies showcased its optical interconnect portfolio at the 2026 OCP Global Summit, with products built for next-generation AI computing networks. Its 1.6T Linear Pluggable Optics modules drew sustained attendee interest during the event.

AI data centers face rising bandwidth density requirements alongside tighter thermal and power limits. Linktel positioned its 1.6T LPO line, including the 1.6T LPO 2DR4, against those constraints, citing energy efficiency, low latency, and supply-chain resilience as core attributes.

The 1.6T LPO 2DR4 is described as operating at power consumption levels as low as 10W. Its linear optics design removes the optical DSP, which reduces signal processing delay and eases component bottlenecks in AI scale-out fabrics. Following the early September 2026 1.6T LPO-MSA Plugfest, Linktel reported multi-switch platform interoperability, and the company stated that these results established a foundation for the 200G-per-wavelength ecosystem.

Additional products displayed included a 12.8T liquid-cooled XPO with a live thermal demonstration for high-density AI nodes. As a founding member of the XPO MSA, Linktel is developing FRO, LRO, and LPO variants for scale-up, scale-out, and scale-across frameworks. The company also showed 6.4T/7.2T NPO modules with covers removed, revealing internal designs for ELS and ILS configurations.

Linktel Engineer Director Dr. Grace Zhang hosted an Executive Session titled “Dispersion Managed Transceiver for Next-Gen AI Fabrics,” covering 800G at 20km and 1.6T at 10km solutions for OCS SuperPOD architectures, along with the feasibility of 400G per lambda at 3km. The DMD product line is already in volume production.

Linktel is inviting ecosystem partners into collaborative development and is open to sharing its U.S.-filed patents to support broader adoption in next-gen AI fabrics.

Press release, provided by Cision on behalf of Linktel Technologies. Read the original.

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