Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling
Applied Materials introduced Centris Spectral SiN ALD and Producer Selectra Mo Etch to improve dielectric deposition and selective metal removal in high-aspect-ratio 3D logic and 3D NAND. The company cites uniform top-to-bottom processing, low-temperature operation, and validation in high-volume manufacturing, targeting yield and device performance.