Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling
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Applied Materials, Inc. introduced two chipmaking systems for precision processing in deep and narrow 3D structures used in logic and memory manufacturing. The company tied the update to the need for more uniform materials work as features move further into tall, narrow stacks where conventional deposition and etch can add variability.
The new systems address material distribution across high-aspect-ratio structures, which the release said can affect electrical performance and manufacturing yield. Applied stated that the deposition and etch tools aim to support continued scaling in logic and memory manufacturing, including advanced nodes and next-generation AI chips.
Centris™ Spectral™ SiN ALD targets uniform silicon nitride deposition in tall, narrow features using microwave plasma technology. Applied described SiN as used for steps including surface passivation, dielectric isolation, and creating patterning spacers, noting the films must be deposited at low temperature and remain chemically robust for downstream processing.
Producer™ Selectra™ Mo Etch adds selective molybdenum removal for wordline separation in 3D NAND. The release described wet etch as limited by difficulty reaching full depth in high-aspect-ratio stacks, and said the new system uses engineered process control and advanced gas delivery to deliver uniform separation across the full stack. Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, said, “As the industry pushes the limits of AI computing, the biggest opportunities are increasingly found in materials engineering,” and added, “With our latest deposition and selective etch systems, we are delivering differentiated capabilities that help customers overcome critical scaling barriers and accelerate the next wave of innovation in logic and memory.” Applied also said it would feature the systems at the 2026 IEEE Symposium on VLSI Technology & Circuits, including a panel discussion on June 16.
Press release, provided by Globe Newswire on behalf of Applied Materials. Read the original.