Enterprise Technology Terminology: E
247 results · page 13 of 13
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Extended detection and response
Extended detection and response is a cybersecurity technology category that unifies telemetry, analytics, and response across multiple security layers to support centralized threat detection, investigation, and remediation for enterprise environments and security operations centers.
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Extended Security Posture Management
Extended Security Posture Management is a broader security management approach that unifies posture data across cloud, identity, data, and on-premises environments to support visibility, control monitoring, and remediation.
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external attacks
External attacks are cyberattacks that originate outside an organization’s trusted network boundary and target internet-facing systems, users, or services, which matters for enterprises because it underpins perimeter security design, zero trust strategies, monitoring priorities, and regulatory cyber risk management.
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External Audit
External audit is an independent assessment of an organization’s financial statements, controls, or compliance performed by a qualified third-party auditor, providing assurance to boards, investors, and regulators that reported information follows applicable standards and that control environments support reliable reporting.
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Extract, Load, Transform
Extract, load, transform is a data integration pattern in which organizations first ingest raw data into a target analytical platform and then perform transformations there, supporting centralized governance, reuse of raw data, and scalable analytics across business and regulatory workloads.
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Extract, Transform, Load
Extract, Transform, Load (ETL) is a structured data integration process that collects data from multiple sources, applies cleansing and transformation rules, and loads it into target repositories, enabling consistent, governed datasets for enterprise analytics, reporting, and compliance-focused data management.
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Extreme Ultraviolet Lithography
Extreme ultraviolet lithography is a semiconductor manufacturing process that uses 13.5-nanometer light and reflective optics in vacuum to pattern very small transistor and interconnect features on silicon wafers, affecting cost, density, and performance characteristics of advanced enterprise-grade chips.