SK hynix ships 12-layer HBM4 samples to customers

SK hynix has shipped samples of its new 12-layer HBM4, an ultra-high performance DRAM designed for Artificial Intelligence (AI) applications, to major customers ahead of schedule. Mass production is targeted for the second half of 2025 following the certification process.

The 12-layer HBM4 features best-in-class capacity and speed, processing more than 2TB of data per second, which is over 60 percent faster than its predecessor, HBM3E. This technology allows for the processing of data equivalent to more than 400 full-HD movies in a second.

The product uses the Advanced MR-MUF process to achieve a capacity of 36GB, preventing chip warpage and enhancing stability through improved heat dissipation. SK hynix aims to solidify its leading position in the AI memory sector after previously achieving milestones such as being the first to mass produce HBM3 in 2022.

“We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands,” said Justin Kim, President & Head of AI Infra at SK hynix. “We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry's largest HBM provider.”