Schneider Electric and AMD release Helios rackscale reference design

Schneider Electric and AMD released a jointly developed and validated reference design for the AMD Helios rackscale solution. The effort provides a scalable blueprint for deploying high-density AI environments, and it served as the first milestone of their collaboration.

The reference design supports planning through deployment for configurations that include facility power, facility cooling, IT space, and lifecycle software. The companies said the design addressed high-density AI workloads on the Helios rackscale solution.

Schneider Electric and AMD described the Helios rackscale setup as powered by AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, AMD Pensando Vulcano NICs, and the open ROCm software ecosystem. They also stated that the reference design targeted high-density AI workloads and used pre-validation for the described physical infrastructure performance areas.

The collaboration outlined a framework for modular AI clusters of up to 10.4 MW IT capacity for greenfield deployments and support for high-density AI workloads up to 246 kW per rack. It included advanced liquid cooling using Motivair by Schneider Electric CDU-based and hybrid air/liquid approaches capable of removing up to 84% of heat, and a digital-first infrastructure approach that referenced ETAP, EcoStruxure IT Design CFD simulation tools, AI-driven predictive maintenance, and integrated Digital Twin capabilities, along with support from AVEVA’s Unified Operations Center. It was validated to ANSI standards for U.S. deployments, with plans to extend the framework to IEC standards later.

“Today organizations require comprehensive, AI-ready reference designs that can take them from planning to deployment faster and with less risk,” said Manish Kumar, Executive Vice President, Secure Power at Schneider Electric. “Through our collaboration with AMD, we're delivering an engineering-backed reference design that bridges the gap between advanced AI compute platforms, energy tech, and real-world data center implementation, enabling customers to deploy scalable, high-density AI environments with greater confidence, efficiency, and speed.” “AMD Helios provides an open, rack-scale architecture built to deliver the performance, efficiency and flexibility required for next-generation AI workloads. By working with Schneider Electric to create a validated reference design, we are giving customers a practical blueprint to accelerate high-density AI deployments, reduce integration risk and scale with greater confidence and efficiency,” said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD.

Provided by Globe Newswire on behalf of Schneider Electric. Click to read original content.