Ceva and LG Electronics Collaborate on UWB SoC Solution

Ceva, Inc. and LG Electronics said they will collaborate to combine Ceva-Waves Ultra-Wideband (UWB) baseband and software with LG’s UWB radio frequency (RF) technology. The effort targets a silicon-ready approach for integrating UWB into system-on-chip designs used by semiconductor and OEM companies building products that use UWB.

The companies said they already secured a major U.S. semiconductor company as a customer for the combined solution. LG’s UWB RF is described as supporting TSMC’s 22nm process, and the collaboration is presented as a way to reduce engineering effort and integration risk for teams incorporating UWB into SoCs.

On the Ceva side, the collaboration pairs Ceva-Waves UWB baseband IP and software with LG’s UWB RF developed by LG’s SoC Center. Ceva also described its next-generation Ceva-Waves UWB architecture as supporting the IEEE 802.15.4ab standard and providing ranging performance in non-line-of-sight environments, including extended range, while maintaining low-power operation and resilience to interference.

Ceva said the platform supports UWB radar sensing and new channels introduced with the next generation of the standard, expanding use of the technology for secure access, asset tracking, indoor navigation, precise positioning, and sensing applications. ABI Research data cited in the release projected UWB device shipments reaching nearly 1.18 billion by 2030, up from 597 million in 2026. “LG has continued to strengthen its semiconductor design capabilities, including advanced RF technologies that are critical to enabling high-performance wireless solutions,” said KANG YongSeok, Vice President, LG Electronics. “By combining LG's UWB RF expertise with Ceva's proven UWB baseband and software technologies, we are creating a complete solution that can help lower the barriers to UWB adoption and enable more companies to bring innovative UWB products to market.” “UWB is entering a new phase as advances in range, performance and sensing open opportunities across automotive, industrial and consumer markets,” said Tal Shalev, Vice President and General Manager of the Wireless IoT Business Unit at Ceva. “Together with LG, we are combining proven baseband, software and RF technologies to give customers a highly integrated foundation for developing differentiated UWB products. Securing a major semiconductor company as a customer is strong validation of our collaboration and the opportunity ahead.”

Press release, provided by Cision on behalf of CEVA. Read the original.