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Deca Technologies partners with IBM for manufacturing in Bromont

Source Decision Insights Record Published May 23, 2025 Companies 1
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25th article in the last 90 days, one of 25 articles referencing IBM. Previous coverage: AI-enabled security and observability updates across cloud and networking - Week of May 12, 2025 (May 2025).

Companies mentioned

IBM Bromont

Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies at IBM’s advanced packaging facility in Bromont, Quebec. This partnership will establish a high-volume manufacturing line focusing on Deca’s M-Series Fan-out Interposer Technology (MFIT).

The collaboration aligns with IBM’s strategy to enhance its advanced packaging capabilities. IBM's plant in Bromont is one of North America’s largest semiconductor assembly and test sites and has contributed to packaging innovation for over 50 years. Recent investments have positioned the site as a Hub for high-performance packaging and chiplet integration, critical for applications in Artificial Intelligence (AI), High performance computing (HPC), and data center.

Deca’s M-Series platform is recognized for its substantial volume, with over seven billion units shipped. The MFIT integrates embedded Bridge DIE for last processor and memory integration, providing efficient connections between chiplets and offering a cost-effective alternative to full silicon interposers, which enhances signal integrity and design flexibility.

This collaboration demonstrates the commitment of both companies to advancing semiconductor packaging. Combining IBM’s expertise with Deca’s technology expands the global supply chain for chiplet integration and computing systems.

Scott Sikorski, Head of Business Development for Chiplets & Advanced Packaging at IBM, stated, “Advanced packaging and chiplet technology are critical for faster, more efficient computing solutions in the age of AI. Deca will help ensure IBM’s Bromont facility remains at the forefront of these innovations, strengthening our commitment to helping our clients bring products to market faster and deliver better performance for AI and data-heavy applications.”

Tim Olson, Founder and CEO of Deca, remarked, “IBM’s rich history in semiconductor innovation and advanced packaging makes them an ideal partner to bring MFIT to high-volume production. We are thrilled to be working together to bring this advanced interposer technology to the North American ecosystem.”

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