Vertiv introduces systems for enhanced AI data center management and efficiency

Vertiv has introduced four new systems aimed at addressing the operational challenges tied to the growth of Artificial Intelligence (AI) applications. The systems include a consolidated management platform, prefabricated modular infrastructure, advanced thermal management solutions, and a high-density Dual Connectivity (DC) rack power shelf. The new offerings enable data centers to effectively manage increased power and heat density resulting from AI workloads. Specifically, the Vertiv Unify software provides visibility and control across critical power and thermal infrastructure, facilitating real-time monitoring and greater operational efficiency in AI-intensive environments. The Vertiv SmartRun is a modular prefabricated overhead infrastructure solution simplifying installation while accommodating high-density power distribution and cooling systems for IT pods. This setup enables up to 1 Megawatt (MW) of power to be deployed in about one day, significantly expediting traditional construction timelines. In addition, the Vertiv CoolLoop RDHx is designed for High performance computing (HPC) and AI applications with energy-efficient air-cooling capabilities that can be integrated with existing cooling systems. It is available in capacities up to 80 kW. The Vertiv PowerDirect Rack serves high-density environments, supporting 50V DC shelf power that allows data centers to increase power capacity and efficiency while maintaining a compact footprint. Scott Armul, executive vice president at Vertiv, noted that these new additions facilitate end-to-end systems integration and help address the complexities associated with accelerated computing in data centers. For further information on these developments, the company has made details available on their website.