Interposer
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A green key on the record, left, is one Decision Insights added. It doesn't exist on the company's site or in a wire feed. The same key labels its row on the right, so you can match them directly. More on how DI enriches a record.
This is what the machine sees: the exact JSON-LD an agent receives for this listing.
{
"@context": "https://schema.org",
"@id": "https://decisioninsights.ai/#website",
"@type": "WebSite",
"name": "Decision Insights",
"potentialAction": {
"@type": "SearchAction",
"target": {
"@type": "EntryPoint",
"urlTemplate": "https://decisioninsights.ai/search/?q={search_term_string}\u0026submit=1"
}
},
"publisher": {
"@id": "https://decisioninsights.ai/#organization"
},
"url": "https://decisioninsights.ai"
}
{
"@context": "https://schema.org",
"@id": "https://decisioninsights.ai/#organization",
"@type": "Organization",
"contactPoint": {
"@type": "ContactPoint",
"contactType": "customer support",
"email": "[email protected]"
},
"description": "Decision Insights is a Registry of technology companies, open source projects, and industry terms, built for people and for AI agents that need sourced, structured information.",
"logo": {
"@type": "ImageObject",
"url": "https://wiretap-cdn-assets.nyc3.cdn.digitaloceanspaces.com/decision-insights/[email protected]"
},
"name": "Decision Insights",
"parentOrganization": {
"@type": "Organization",
"name": "Wiretap Labs",
"sameAs": [
"https://www.linkedin.com/company/wiretap-labs",
"https://www.crunchbase.com/organization/wiretap-labs"
],
"url": "https://wiretaplabs.com"
},
"publishingPrinciples": "https://decisioninsights.ai/standards/",
"sameAs": [
"https://www.linkedin.com/company/decisioninsights"
],
"url": "https://decisioninsights.ai"
}
{
"@context": "https://schema.org",
"@type": "BreadcrumbList",
"itemListElement": [
{
"@type": "ListItem",
"item": "https://decisioninsights.ai",
"name": "Decision Insights",
"position": 1
},
{
"@type": "ListItem",
"item": "https://decisioninsights.ai/term/",
"name": "Glossary",
"position": 2
},
{
"@type": "ListItem",
"item": "https://decisioninsights.ai/term/interposer/",
"name": "Interposer",
"position": 3
}
]
}
{
"@context": "https://schema.org",
"@id": "https://decisioninsights.ai/term/interposer/#definedterm",
"@type": "DefinedTerm",
"additionalProperty": [
{
"@type": "PropertyValue",
"name": "Articles mentioning this entity",
"value": 1
},
{
"@type": "PropertyValue",
"name": "Related terms",
"valueReference": [
{
"@id": "https://decisioninsights.ai/term/interposer-technology/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/interposer-technology/",
"name": "Interposer Technology"
},
{
"@id": "https://decisioninsights.ai/term/silicon-interposer/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/silicon-interposer/",
"name": "Silicon Interposer"
},
{
"@id": "https://decisioninsights.ai/term/photonic-interposer-pi/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/photonic-interposer-pi/",
"name": "Photonic Interposer"
},
{
"@id": "https://decisioninsights.ai/term/chip-to-chip-interconnect/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/chip-to-chip-interconnect/",
"name": "Chip-to-Chip Interconnect"
},
{
"@id": "https://decisioninsights.ai/term/electronic-interconnect/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/electronic-interconnect/",
"name": "Electronic Interconnect"
},
{
"@id": "https://decisioninsights.ai/term/interconnection/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/interconnection/",
"name": "Interconnection"
},
{
"@id": "https://decisioninsights.ai/term/integrated-circuits-ics/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/integrated-circuits-ics/",
"name": "Integrated Circuits"
},
{
"@id": "https://decisioninsights.ai/term/die-to-die-interconnect/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/die-to-die-interconnect/",
"name": "Die-to-Die Interconnect"
}
]
},
{
"@type": "PropertyValue",
"name": "Related terms (co-occurring topics)",
"valueReference": [
{
"@id": "https://decisioninsights.ai/term/advanced-packaging/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/advanced-packaging/",
"name": "Advanced Packaging"
},
{
"@id": "https://decisioninsights.ai/term/ai-infrastructure/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/ai-infrastructure/",
"name": "AI infrastructure"
},
{
"@id": "https://decisioninsights.ai/term/ai-artificial-intelligence/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/ai-artificial-intelligence/",
"name": "Artificial Intelligence"
},
{
"@id": "https://decisioninsights.ai/term/chiplets/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/chiplets/",
"name": "Chiplets"
},
{
"@id": "https://decisioninsights.ai/term/data-center/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/data-center/",
"name": "Data Center"
},
{
"@id": "https://decisioninsights.ai/term/high-performance-computing-hpc/#definedterm",
"@type": "DefinedTerm",
"mainEntityOfPage": "https://decisioninsights.ai/term/high-performance-computing-hpc/",
"name": "High performance computing"
}
]
}
],
"description": "Interposer is an intermediate substrate that electrically connects semiconductor dies to each other or to a package or circuit board in advanced assemblies; it matters in enterprise hardware because it enables high-bandwidth, high-density integration for data center and high-performance systems.",
"inDefinedTermSet": {
"@id": "https://decisioninsights.ai/term/#termset",
"@type": "DefinedTermSet",
"url": "https://decisioninsights.ai/term/"
},
"name": "Interposer",
"subjectOf": [
{
"@id": "https://decisioninsights.ai/deca-technologies-partners-with-ibm-for-manufacturing-in-bromont/#blogposting",
"@type": "BlogPosting",
"headline": "Deca Technologies partners with IBM for manufacturing in Bromont",
"url": "https://decisioninsights.ai/deca-technologies-partners-with-ibm-for-manufacturing-in-bromont/"
}
],
"url": "https://decisioninsights.ai/term/interposer/"
}
{
"@context": "https://schema.org",
"@id": "https://decisioninsights.ai/term/interposer/",
"@type": "CollectionPage",
"dateModified": "2026-08-24T01:23:28Z",
"description": "Interposer is an intermediate substrate that electrically connects semiconductor dies to each other or to a package or circuit board in advanced assemblies; it matters in enterprise hardware because it enables high-bandwidth, high-density integration for data center and high-performance systems.",
"isPartOf": {
"@id": "https://decisioninsights.ai/#website"
},
"mainEntity": {
"@id": "https://decisioninsights.ai/term/interposer/#definedterm"
},
"name": "Interposer",
"sdDatePublished": "2026-08-24",
"sdPublisher": {
"@id": "https://decisioninsights.ai/#organization"
},
"url": "https://decisioninsights.ai/term/interposer/"
}
Graph
A glossary entry defines a term and stops there. It doesn't show where the term is actually being used or written about. We track and link every article that covers it.
Counted facts
A dictionary definition doesn't say how often a term is actually used. This counts it across the graph -- articles that mention it, open source projects tagged with it, and the organizations tagged with it, listed here alongside the count. A term has no peer companies, and nothing here claims otherwise.