SK hynix completes development and prepares for mass production of HBM4

SK hynix has completed development and prepared for mass production of HBM4, a High Bandwidth Memory (HBM) product designed for Artificial Intelligence (AI) applications. The company positioned HBM4 to support customer requirements and maintain competitiveness in the semiconductor market.

HBM4 features doubled bandwidth and a 40% improvement in power efficiency compared to previous generations. The product implements 2,048 I/O terminals, significantly enhancing data processing capabilities. It aims to improve AI service performance, which the company estimates could be as high as 69% when deployed.

In a statement, Joohwan Cho, Head of HBM Development at SK hynix, stated, “By supplying the product that meets customer needs in performance, power efficiency and reliability in a timely manner, the company will fulfill time to market and maintain competitive position.”

SK hynix's HBM4 mass production is expected to address increasing demand for HBM in data centers, particularly as organizations seek to improve power efficiency amid rising operational costs. The company has surpassed JEDEC standards with over 10Gbps operating speed in HBM4.

Justin Kim, President and Head of AI Infra at SK hynix, emphasized that HBM4 represents a turning point beyond current AI infrastructure limitations. He expressed the intent to position the company as a full-stack AI memory provider.