Micron Technology showcases AI memory and storage portfolio at COMPUTEX 2026

Micron Technology, Inc. presented an end-to-end AI memory and storage portfolio at COMPUTEX 2026, covering products from high-bandwidth memory to data center and client SSDs. The company tied the showcase to changing requirements as AI workloads move from training to large-scale inference.

Micron said it expects demands to intensify across memory hierarchy layers, citing increasing AI context lengths and rising memory content per server. It also framed memory and storage as strategic assets in the semiconductor ecosystem.

In its portfolio description, Micron connected HBM to high-speed model execution and hot key-value (KV) cache, with LPDDR and DDR used for system memory for orchestration and long-context expansion. It also described data center SSDs as drives for persistent KV cache and for high-capacity data storage, and listed additional memory and storage options including SOCAMM, RDIMMs, LPCAMM, GDDR, GDDR7, and client SSDs.

Micron cited specific product milestones, including HBM4 36GB 12H and SOCAMM2 at 256GB, plus a 256GB DDR5 RDIMM sample. For storage, the company referenced the Micron 9650 SSD, Micron 6600 ION up to 245TB, and the Micron 4600 PCIe Gen5 NVMe SSD, along with UFS 4.1. Sumit Sadana said, “AI context lengths are increasing by 30 times per year,1 while memory content per server has doubled in the past three years,2” and added, “System performance is now driven by memory bandwidth and memory capacity, more than ever before.”