Accelsius Joins ARPA-E COOLERCHIPS Project to Advance Hybrid Cooling Technologies for the Data Center of the Future

Accelsius has been selected to contribute to a U.S. Department of Energy ARPA-E project led by Professor Dereje Agonafer at The University of Texas at Arlington. The project, titled “Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future,” aims to develop a hybrid cooling architecture that integrates direct-to-chip evaporative cooling with air-based solutions like rear door heat exchangers.

To assist in system-level testing, Accelsius will provide its MR250, a multi-rack, in-row 250kW two-phase Coolant Distribution Unit (CDU), along with integration support. The MR250 will be part of the project's test infrastructure at the UT Arlington campus, with General Availability (GA) scheduled for late 2025.

Professor Agonafer noted, “The addition of Accelsius technology to our lab and project will improve our understanding and benchmarking of two-phase, direct-to-chip cooling as a practical and scalable option for growing rack densities.” He also invited attendees of the upcoming ITherm event to tour the lab for an in-depth look at the project and its technologies.

The COOLERCHIPS initiative focuses on optimizing cooling operations to enhance energy, reliability, and carbon efficiency in information processing systems, aiming to lower cooling energy consumption to under 5% of a data center’s IT load while ensuring reliability for high-density compute.

Peter de Bock, program director at ARPA-E, commented on the collaboration, expressing enthusiasm about the contribution of Accelsius and The University of Texas at Arlington toward enhancing data center efficiency.

Disaster Recovery (DR). Richard Bonner, chief technology officer at Accelsius, stated, “This project provides a bigger stage to showcase the advancements we’ve made in two-phase cooling and to push the envelope on what’s possible for future data center efficiency.”