Skorpios Technologies introduces Tru-SiPh optical engines for AI data centers

Skorpios Technologies revealed its Tru-SiPh™ Optical Engine platform, including 1.6 Tbps and 6.4 Tbps Photonic Integrated Circuits (PICs) designed for deployment in Artificial Intelligence (AI) data centers. The company stated these products are intended to support 102.4 Tbps Ethernet switches for hyperscale AI infrastructures.

The announcement highlighted the platform's role in addressing the need for ultra-high bandwidth optical interconnects in large AI clusters. Skorpios reported that its offering reduces cost per bit by over 30% in transceiver deployments starting in 2026, accompanied by lower power consumption and reduced physical footprint, which are critical for large-scale AI data center economies.

The Tru-SiPh™ platform combines several technical features, including an open, hot-pluggable architecture for the 6.4 Tbps Optical Engine that supports modular replacement without interrupting the 102.4 Tbps switching fabric. The design incorporates integration of lasers, amplifiers, modulators, and photodiodes within silicon, enabling operation at temperatures up to 85°C without dedicated cooling. Compatibility with Broadcom TH6 and next-generation networking ASICs was also specified.

Skorpios described the architectural specifics such as multiple 6.4 Tbps DR32 Optical Sub-Assemblies comprising four 1.6 Tbps Optical Engines each, streamlined packaging, support for various connector types, and internally redundant lasers with projected lifespans reaching up to 45 years. The platform utilizes a silicon interposer for high-speed electrical routing and claims approximately 30% lower power use compared to existing optical architectures.

Gunter Reiss, Chief Revenue Officer of Skorpios Technologies, said, “AI factories will become the power plants of the intelligence economy. To build them, hyperscalers need optical interconnects that deliver massive bandwidth while minimizing power and cost per bit. By integrating redundant lasers, amplifiers, modulators, and photodiodes directly into silicon using our Tru-SiPh™ platform, Skorpios is enabling the most compact and efficient 1.6T and 6.4T optical engines powering the optical backbone of next-generation AI infrastructure.” Damien Lambert, CTO, also commented, “External-Laser Small Form Factor Pluggables (ELSFPs) belong to the previous generation of optical networking. AI factories need something far more robust in 2026. Our Tru-SiPh™ platform integrates both primary and backup lasers directly into the Photonic Integrated Circuit (PIC) with real-time monitoring and seamless failover, delivering up to 45 years of time to 0.25% cumulative failure at maximum temperature. By eliminating costly external laser architectures and embedding laser redundancy directly into silicon, Tru-SiPh™ enables the most compact and power efficient Optical Engine, allowing hyperscalers to pair it with next-generation networking ASICs like Broadcom Tomahawk 6 while maximizing uptime, serviceability, and scalability for AI factory networks.”

Skorpios indicated plans to provide samples of the Tru-SiPh™ 1.6 Tbps and 6.4 Tbps Optical Engines to customers and partners in the second quarter of 2026. The company also stated intentions to introduce future optical engines in the third quarter of 2026 capable of 400G per lane operation at temperatures up to 120°C with laser reliability specified up to 45 years. A demonstration event featuring these products was scheduled for March 15–19, 2026.