onsemi’s Treo platform selected by Teledyne for advanced infrared imaging design
Treo’s ROIC process technology leverages high-density, low-power architecture for mission-critical aerospace, defense, security, and scientific applications.
onsemi announced that Teledyne Technologies selected its Treo platform to develop next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs) for infrared imaging systems. This platform, noted for its advanced analog and mixed-signal capabilities, supports the demands of infrared focal plane array (FPA) systems, which are vital for a range of applications across aerospace, defense, and security sectors.
Built on a 65nm process node, the Treo platform incorporates a modular architecture alongside an extensive library of Internet Protocol (IP) building blocks intended to accelerate development and reduce time-to-market. Its ROIC process technology combines onsemi's existing ROIC offerings with Treo’s precision analog, advanced digital, and low-voltage power features to provide a unique solution.
Key features of the Treo platform include increased gate density that enhances functionality without expanding physical size, reduced power dissipation for improved efficiency, and dense on-chip energy storage that maintains signal integrity. Additional functionalities include low resistivity substrates for radiation resilience, a wide operational temperature range, and Decentralized Inference Engine (DIE) stitching capabilities for larger sensor formats.
These capabilities allow Teledyne to create smaller, faster, and more reliable imaging systems that operate effectively in extreme conditions. Anders Petersen, Chief Engineer and Fellow at Teledyne Imaging Sensors, noted, “The ability to deliver high-performance imaging sensors that operate reliably in the harshest environments is critical for our space products.”
Michel De Mey, Vice President of the Sensor Interface Division at onsemi, stated, “onsemi’s Treo platform is designed to accelerate innovation and reduce time to market by combining a modular architecture with a comprehensive library of proven IP building blocks.”
The Treo platform is manufactured at onsemi’s facility in East Fishkill, NY, which holds Category 1A Trusted Supplier accreditation, aligning with the U.S. government's objectives for domestic chip manufacturing to bolster national security.