Molex Incorporated Agrees to Acquire Teramount Ltd. for TeraVERSE
3 companies named across 6 categories, one of 2 articles referencing Molex. Previous coverage: OFC 2026 – Scaling Up Optical Network Density (Apr 2026).
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Molex Incorporated agreed to acquire Teramount Ltd., a company in Israel that develops detachable fiber-to-chip connectivity solutions. The agreement relates to Teramount’s technology for co-packaged optics, where Molex expects the acquisition to support its optical interconnect portfolio as Teramount continues engineering work.
Molex’s agreement centers on Teramount’s TeraVERSE platform, which combines a universal photonic coupler and wafer-level self-aligning optics. Molex said Teramount’s approach is designed as a passively aligned fiber-to-chip interface intended for high-volume co-packaged optics and other silicon photonics applications.
Teramount’s detachable coupling approach uses passive alignment and wafer-level self-aligning optics, which the companies said supports large assembly tolerances and semiconductor-grade wafer-level processes. The platform is described as providing a field-serviceable interface between optical fiber and silicon photonics chips.
The companies said the acquisition builds on a commercial relationship formed after Koch Disruptive Technologies led Teramount’s $50M Series A financing in 2025. Molex also said Teramount would remain a design and engineering center in Jerusalem, supported by Molex’s global optical capabilities, and that the deal was expected to close in the first half of 2026, subject to regulatory approvals and customary closing conditions.
“Teramount's TeraVERSE technology fills a crucial gap in the CPO stack, offering an advantaged and strategic complement to our optical solutions portfolio. With a practical, detachable fiber-to-chip interface we are afforded a foundational element to realize mainstream CPO adoption,” said Aldo Lopez, president, Datacom Solutions, Molex. “Combining Teramount's IP and engineering talent with Molex's innovative portfolio, manufacturing scale, supply-chain expertise and systems know-how gives customers an integrated, high-volume path to deploy scalable CPO.” “Harnessing Molex's global scale and system-level expertise with Teramount's innovation expertise and detachable, wafer-level coupling technology creates a real pathway for scalable, high-density CPO,” said Hesham Taha, CEO and co-founder of Teramount. “Joining forces with Molex will enable us to accelerate delivery of a manufacturable, serviceable fiber-to-chip interface that meets the pressing needs of AI and hyperscale data centers.”
Press release, provided by Cision on behalf of Molex. Read the original.