Micron Technology, Inc. completes Tongluo site acquisition

Micron Technology, Inc. completed the acquisition and assumed ownership of Powerchip Semiconductor Manufacturing Corporation’s P5 site in Tongluo, Miaoli County, Taiwan. The company brought the property into its Taiwan operations, placing the facility under Micron’s control following the previously disclosed acquisition agreement.

The Tongluo location sits roughly 15 miles from Micron’s vertically integrated mega campus in Taichung and was described in the announcement as an extension of those operations. Micron presented the site as a complementary element to its existing Taiwan footprint.

The property included approximately 300,000 square feet of existing 300mm cleanroom space and the announcement referenced leading-edge DRAM products, including High Bandwidth Memory (HBM), in connection with AI-driven demand. The facility’s existing cleanroom capacity and wafer size were identified in the acquisition materials.

Micron began preparations for the Tongluo site following the January 17, 2026 announcement and completed the transaction on March 15, 2026, assuming ownership under the previously disclosed agreement. The company also acknowledged collaboration with PSMC and with Taiwan central government entities and the Miaoli County Government during the acquisition process.

“The Tongluo facility complements our Taiwan operations and is a critical component of our global expansion plans,” said Manish Bhatia, executive vice president of global operations at Micron Technology. “Memory is a strategic asset that dictates AI product performance, and the acquisition and phased ramp of this site strengthens our ability to capitalize on these significant opportunities. We appreciate the strong collaboration from the Taiwan government, our construction partners, and equipment and materials suppliers to enable and accelerate the ramp of our production capacity at this site.”

Micron said it planned to begin retrofitting the existing cleanroom in March, expected meaningful product shipments from the existing Chip Fabrication Plant (Fab) beginning in fiscal 2028, and planned to begin construction by the end of fiscal 2026 on a second facility of comparable scale, adding approximately 270,000 square feet of cleanroom space.