Texas Instruments introduces new power-management chips for data centers

Texas Instruments has introduced new power-management chips aimed at meeting the growing power demands of modern data center. These products include the TPS1685, the first 48V integrated hot-swap eFuse with power-path protection, designed to assist data center hardware. Additionally, the company unveiled a range of integrated gallium nitride (GaN) power stages in standard TOLL packaging, which feature advanced protection and enhance efficiency.

The TPS1685 enables data center designers to manage power levels beyond 6kW while simplifying system design. The new GaN power stages integrate a high-performance gate driver with a 650V GaN transistor, achieving over 98% efficiency and addressing the challenges of high-power density required for server applications.

Robert Taylor, general manager of Industrial Power Design Services at TI, stated, “While advanced chips drive AI's computational power, analog semiconductors are key to maximizing energy efficiency.” This aligns with TI's goal of enabling data center to reduce their environmental footprint.

Texas Instruments is showcasing these developments at the 2025 Applied Power Electronics Conference (APEC) held from March 16-20 in Atlanta. The company aims to present solutions that enhance power density and operational efficiency in various applications.

Preproduction quantities of the TPS1685, along with the new GaN power stages, are available for order on TI's website, supported by evaluation modules for further testing.