Broadcom expands 200G/lane DSP PHY portfolio for AI clusters

Broadcom Inc. has added two new products, Sian3 and Sian2M, to its 200G/lane Data Stewardship Program (DSP) PHY portfolio, targeting the power efficiency and performance requirements of Artificial Intelligence (AI) and Machine Learning (ML) clusters. These products aim to meet the growing demand for increased Bandwidth and interconnect density in AI applications, particularly in 800G and 1.6T optical transceiver deployments. Sian3 features a 3nm design and offers the lowest power consumption available for 800G and 1.6T transceivers using Single-Mode Fiber (SMF). By improving on the Sian2 DSP, Sian3 achieves over 20% power reduction for 1.6T modules utilizing electro-absorption modulators (EML) and silicon photonics (SiP). In contrast, Sian2M is optimized for short-reach multi-mode fiber (MMF) links and incorporates vertical-cavity surface-emitting laser (VCSEL) drivers. According to Vijay Janapaty, Broadcom's vice president of the Physical Layer Products Division, these DSPs enable customers to scale AI clusters effectively to accommodate rising AI workload demands. The company anticipates a substantial market for PAM4 DSPs within AI infrastructure, predicting significant shipments in the upcoming years. Sian3 will enter production in the third quarter of 2025, with samples now available to select partners and customers.