OCP Open Domain-Specific Architecture (ODSA)

OCP Open Domain-Specific Architecture (ODSA) is an Open Compute Project initiative that defines open chiplet-based interface standards and reference architectures for disaggregated silicon and advanced packaging in data center and edge hardware (hardware architecture / semiconductor integration).

• Open specifications and reference architectures for multi-chip and chiplet-based systems (hardware architecture).
• Standardized die-to-die interfaces and protocols for chiplet integration across different vendors (interconnect / interface standards).
• Frameworks for interoperable chiplet ecosystems covering design, packaging, and integration workflows (ecosystem / interoperability).
• Guidance for applying domain-specific architectures in data center, networking, and accelerator platforms (data center infrastructure).
• Collaboration within the Open Compute Project community to align chiplet and domain-specific architectures with open hardware designs (open hardware standards).

More About OCP Open Domain-Specific Architecture

OCP Open Domain-Specific Architecture (ODSA) operates as a project within the Open Compute Project focused on open standards and architectures for chiplet-based and domain-specific computing (hardware architecture). Its core problem space is the technical and organizational fragmentation around integrating multiple dies, or chiplets, from different sources into cohesive systems for data center, networking, and accelerator workloads. By defining open interfaces and reference architectures, ODSA targets predictable interoperability across vendors and manufacturing ecosystems.

The project centers on standardized die-to-die connections and protocols (interconnect / interface standards) that enable multiple chiplets to function together in a shared package or module. This includes interface definitions intended for use in high-bandwidth, low-latency communication between chiplets, as well as architectural guidance on how those interfaces fit into broader system design. ODSA materials also address aspects of packaging and integration (advanced packaging) so that electrical, mechanical, and thermal considerations align with open, reusable designs.

For enterprise and institutional environments, ODSA is positioned as part of the open hardware and data center infrastructure stack (data center infrastructure). Enterprises that consume OCP-compliant servers, accelerators, or networking equipment can reference ODSA specifications as a way to understand how chiplet-based subsystems might achieve interoperability and vendor mix-and-match. Hardware designers, foundry partners, and packaging houses use ODSA as a basis for collaborative design, enabling domain-specific accelerators and custom silicon to coexist with more general-purpose components under a shared interface framework.

ODSA is tightly associated with OCP’s broader open hardware ecosystem (open hardware standards). It aligns chiplet and domain-specific architectures with open server, storage, and networking platforms, so that silicon-level disaggregation connects cleanly to board-level and rack-level designs. This includes alignment with standardized form factors, power delivery approaches, and system management concepts present in the wider OCP portfolio.

From a taxonomy perspective, ODSA falls into hardware architecture standards and open interface specifications for chiplet-based systems (hardware architecture / interconnect). It provides reusable definitions and reference designs that enterprises, silicon vendors, and integrators can adopt to reduce custom integration work when building domain-specific compute platforms. The project’s outputs are intended for technical stakeholders such as chip architects, system designers, and platform engineers who need shared, open reference points for multi-chip packaging and heterogeneous compute integration.