CHIPS Alliance AIB Specification
The CHIPS Alliance AIB Specification is an open standard hardware interface specification for die-to-die chiplet interconnect within multi-die systems-on-chip and packages.
- Defines a die-to-die physical and logical interface for chiplet connectivity (hardware interface standard).
- Targets multi-die, multi-chiplet integration within a single package for SoC-style systems (semiconductor packaging).
- Specifies signaling, clocking, and link behavior between dies to support high-bandwidth communication (interconnect protocol).
- Supports reuse and interoperability of chiplets developed by different design teams or vendors (ecosystem interoperability).
- Developed and maintained under CHIPS Alliance governance as an open interface specification (open standard governance).
More About github.com
The AIB (Advanced Interface Bus) Specification hosted in the CHIPS Alliance GitHub repository defines an open die-to-die interface standard (hardware interface standard) intended for integrating multiple dies or chiplets within a single package. It addresses the problem of connecting separately fabricated dies in a way that supports high-bandwidth communication, predictable electrical behavior, and reuse of independently developed chiplets.
The specification describes the interface at the signaling and protocol level for short-reach, in-package connections between dies (interconnect protocol). This includes the arrangement of I/O pins, signaling conventions, clocking schemes, and link-level behavior required to move data reliably between chiplets. By standardizing the interface, AIB enables design teams to treat chiplets as modular components that can be combined on a common substrate or interposer (semiconductor packaging), rather than as tightly coupled monolithic SoC blocks.
In enterprise and institutional environments, AIB is relevant for semiconductor vendors, IP providers, and system companies that design multi-die systems such as accelerators, networking devices, or custom computing solutions (semiconductor design infrastructure). The specification provides a reference for IP development, package design, and test planning when organizations adopt a chiplet-based architecture. Engineering teams can align PHY, package, and system-level design decisions to the constraints and behaviors defined in the AIB specification.
The project is governed by CHIPS Alliance, which maintains the AIB specification and related collateral under an open collaboration model (open standard governance). The GitHub repository serves as the authoritative location for the textual specification, change history, and issue tracking. This structure allows hardware designers, verification engineers, and tool vendors to coordinate around a single shared definition of the interface, improving interoperability across IP blocks and design flows.
From a technical taxonomy perspective, the AIB Specification fits into die-to-die and chiplet interconnect standards (interconnect protocol), with relevance to Multi-Chip Module (MCM) and 2.5D/3D package design (semiconductor packaging). It interacts with, but is distinct from, higher-level protocols or application logic that may run over the physical link. For enterprises building custom silicon or adopting chiplet-based architectures, the AIB specification provides a common, openly documented interface that can be integrated into internal design methodologies, IP qualification processes, and long-term platform roadmaps.