CoolIT Systems introduces 4000W coldplate for liquid cooling

CoolIT Systems has introduced a new 4000W-ready single-phase Direct Liquid Cooling (DLC) coldplate, exceeding prior limits of the technology. This development aims to support ultra-high watt microprocessors, solidifying the company's role within the liquid cooling sector, particularly in Artificial Intelligence (AI) and High performance computing (HPC). VP of Engineering Kamal Mostafavi stated, “CoolIT continues to lead the industry in performance. We are thrilled to show silicon leaders that single-phase DLC will continue to be a key enabling technology with demonstrated capability for up to 4000W processors.” He emphasized that this method is known for its reliability and scalability in cooling. The single-phase DLC technology operates by removing heat from semiconductors using water or a water-glycol mixture through coldplates attached to the chips. Current standards recognize it as the most widely deployed liquid cooling solution available. Testing demonstrated that the new coldplate could capture over 97% of heat from a 4000W thermal test vehicle, operating at a flow rate of 6 liters per minute, the recommended flow amount for high-wattage chips. Lower flow rate tests produced similarly favorable outcomes. With an ultra-low thermal resistance of Tr <0.009 C/W, the coldplate maintains a full flow loop pressure drop of only 8 PSI. CoolIT's coldplates employ Split-Flow™ technology, which enhances thermal and flow performance by 30% compared to standard models, while enabling targeted cooling. The successful testing results reinforce CoolIT's position in the liquid cooling market, indicating the technology's suitability for future ultra-high-wattage semiconductors. For further technical details, the company offers a downloadable technical brief available on their website.