Applied Materials, CEA-Leti deepen partnership for AI solutions

Applied Materials, Inc. and CEA-Leti have announced an expansion of their partnership focused on advancing materials engineering solutions to improve energy efficiency in Artificial Intelligence (AI) data centers. The two organizations have signed a memorandum of understanding to deepen their collaboration.

Joint Lab Focus

The partnership will emphasize developing specialty semiconductors for the ICAPS markets, which are vital for applications across Internet of Things (IoT), communications, automotive, and power sectors. Such chips play a crucial role in data management and power control within data center environments.

Enhancements and Equipment

As part of the enhanced agreement, the organizations will upgrade their joint lab with new equipment to facilitate comprehensive development of specialty devices. This includes state-of-the-art packaging tools intended for chip integration from diverse wafer types, aiming to create innovative specialty devices.

Facility and Expertise

The collaborative facility will leverage Applied Materials’ wafer processing systems in conjunction with CEA-Leti’s proficiency in new material evaluation and device performance assessment. The planned upgrades are expected to bolster France’s semiconductor ecosystem while fostering innovation within the Grenoble technology hub.

Aninda Moitra, corporate vice president at Applied Materials, expressed enthusiasm about the long-term collaboration, stating, “We are excited to strengthen our capabilities for accelerating innovation and commercialization of next-generation specialty chips.”

CEA-Leti CEO Sébastian Dauvé acknowledged that the initial phase of the partnership has set a solid groundwork for addressing materials-engineering obstacles linked to specialty semiconductor devices and highlighted a mutual dedication to technical advancement that aligns with industrial demands.