Applied Materials and CEA-Leti Expand Joint Lab

Applied Materials, Inc. and CEA-Leti have advanced their partnership to drive development of materials engineering solutions aimed at enhancing energy efficiency in Artificial Intelligence (AI) data centers. The organizations signed a memorandum of understanding (MOU) to expand their collaboration.

The focus of their joint lab is on innovations for specialty semiconductors catering to the ICAPS markets, including applications in Internet of Things (IoT), communications, automotive, and power sectors. These specialized chips are increasingly essential for managing data and power in data center environments.

Under the expanded agreement, Applied and CEA-Leti plan to enhance the joint lab with new equipment to support comprehensive development of specialty devices. This includes advanced packaging tools for integrating chips from various wafer types, which will enable novel specialty devices for future applications.

The joint facility incorporates Applied Materials’ wafer processing systems along with CEA-Leti’s expertise in evaluating new materials and device performance. The anticipated upgrades aim to strengthen France’s semiconductor ecosystem and support innovation within the Grenoble technology hub.

“Applied Materials and CEA-Leti have a long history of successful collaboration, and we are excited to strengthen our capabilities for accelerating innovation and commercialization of next-generation specialty chips,” said Aninda Moitra, corporate vice president at Applied Materials.

CEA-Leti CEO Sébastian Dauvé noted that the collaboration’s initial phase established a foundation for tackling materials-engineering challenges associated with specialty semiconductor devices, indicating a shared commitment to achieving technological progress that meets industrial and societal needs.