ADLINK Technology Inc. introduced Express-PTL COM modules

ADLINK Technology Inc. introduced the Express-PTL family of COM modules powered by Intel Core Ultra Series 3 processors, presenting a compute option designed for complex edge Artificial Intelligence (AI) workloads.

The company described industrial-temperature SKUs and features intended for rugged and mission-critical operation, and it outlined reference development kits and carriers to support prototyping and system integration.

The Express-PTL combined an integrated Neural Processing Unit (NPU) 5 rated up to 50 TOPS, an Intel Arc Graphics Processing Unit (GPU) with up to 12 Xe cores and up to 120 TOPS, and a hybrid Central Processing Unit (CPU) architecture supporting up to 16 CPU cores, with the aggregate platform delivering up to 180 TOPS of AI compute; modules supported up to 128 GB DDR5 Small Outline Dual In-line Memory Module (SO-DIMM) with IBECC, and offered PCI Express (PCIe) interfaces for higher-bandwidth accelerator interaction.

ADLINK detailed additional module attributes including a hybrid CPU layout of 4 P cores, 8 E cores, and 4 Least Privilege Execution (LPE) cores, industrial-temperature operation from –40°C to 85°C, TCC, Time-Sensitive Networking (TSN) Ethernet, in-band Elliptic Curve Cryptography (ECC), and FuSa/FSEDP compliance; the company also described the COM-HPC-mPTL, SBC35-PTL, and MXE-330 designs, noting soldered-down memory on the COM-HPC-mPTL, a 95 mm x 70 mm module size, a 3.5-inch SBC form factor, and an Adaptive Function Module design for customizable I/O.

ADLINK scheduled the COM-HPC-mPTL for release in Q2 2026, planned the SBC35-PTL and MXE-330 for Q3 2026, and said development kits for Express-PTL and COM-HPC-mPTL would be available in Q2 2026.