ADLINK Expands COM Lineup Featuring NXP i.MX 95 SMARC and Open Standard Module (OSM)-Based Solutions

ADLINK Technology introduced two new modules, the OSM-i.MX95 and SMARC LEC-i.MX95, utilizing the NXP i.MX95 processor. These modules are designed to provide up to 2 TOPS of Artificial Intelligence (AI) performance and comply with both SGeT SMARC 2.2 and OSM OSM 1.2 standards, addressing the needs of edge computing in various industrial sectors.

The OSM-i.MX95 is a rugged, compact 45mm x 45mm soldered module that supports AI-powered applications for small, power-constrained devices. It is built to withstand extreme environments, making it suitable for uses in smart cities, medical diagnostics, and robotics systems. Its single-sided PCB design aims to reduce manufacturing costs and enhance reliability by minimizing thermal and mechanical stress.

The SMARC LEC-i.MX95, measuring 82mm x 50mm, offers enhanced connectivity options including 10 GbE and secure boot features. This module targets applications in sectors such as Internet of Things (IoT) and automation, enabling real-time data processing and communication in smart infrastructure. With a focus on flexibility, it supports easy integration with various carrier boards, catering to both high-volume and low-volume production scenarios.

Both modules utilize the NXP i.MX95 processor, which combines multi-core processing capabilities with a Neural Processing Unit (NPU) designed for advanced data analytics and AI applications. These modules come equipped with additional features, such as image processing and high-quality graphics support, making them suitable for diverse application demands within commercial, industrial, and medical markets.

Provided by Cision on behalf of ADLINK Technology. Click to read original content.