ADLINK Expands COM Lineup Featuring NXP i.MX 95 SMARC and Open Standard Module (OSM)-Based Solutions

ADLINK Technology introduced two new modules, the OSM-i.MX95 and SMARC LEC-i.MX95, utilizing the NXP i.MX95 processor. These modules are designed to provide up to 2 TOPS of Artificial Intelligence (AI) performance and comply with both SGeT SMARC 2.2 and Optical Switching Matrix (OSM) OSM 1.2 standards, addressing the needs of edge computing in various industrial sectors.

The OSM-i.MX95 is a rugged, compact 45mm x 45mm soldered module that supports AI-powered applications for small, power-constrained devices. It is built to withstand extreme environments, making it suitable for uses in smart cities, medical diagnostics, and robotics systems. Its single-sided PCB design aims to reduce manufacturing costs and enhance reliability by minimizing thermal and mechanical stress.

The SMARC LEC-i.MX95, measuring 82mm x 50mm, offers enhanced connectivity options including 10 GbE and secure boot features. This module targets applications in sectors such as Internet of Things (IoT) and automation, enabling real-time data processing and communication in smart infrastructure. With a focus on flexibility, it supports easy integration with various carrier boards, catering to both high-volume and low-volume production scenarios.

Both modules utilize the NXP i.MX95 processor, which combines multi-core processing capabilities with a Neural Processing Unit (NPU) designed for advanced data analytics and AI applications. These modules come equipped with additional features, such as image processing and high-quality graphics support, making them suitable for diverse application demands within commercial, industrial, and medical markets.