Accelsius selected for DOE ARPA-E project on hybrid cooling

Accelsius has been appointed to participate in a U.S. Department of Energy ARPA-E initiative headed by Professor Dereje Agonafer at The University of Texas at Arlington. This initiative, named “Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future,” seeks to create a hybrid cooling framework that combines direct-to-chip evaporative cooling with air-based methods, such as rear door heat exchangers.

As part of the project, Accelsius will supply its MR250, a two-phase Coolant Distribution Unit (CDU) capable of 250 kW, for system-level testing and provide integration assistance. The MR250 will be utilized within the testing facilities at the UT Arlington campus, with General Availability (GA) aimed for late 2025.

Professor Agonafer indicated, “The addition of Accelsius technology to our lab and project will improve our understanding and benchmarking of two-phase, direct-to-chip cooling as a practical and scalable option for growing rack densities.” He also encouraged attendees of the forthcoming ITherm event to visit the lab to observe the project and its associated technologies.

The COOLERCHIPS initiative aims to optimize cooling operations to improve the energy efficiency, reliability, and carbon footprint of information processing systems, targeting a reduction in cooling energy consumption to below 5% of a data center’s IT load while maintaining reliability for high-density compute setups.

Peter de Bock, program director at ARPA-E, expressed support for this collaboration, highlighting Accelsius and The University of Texas at Arlington's efforts to improve data center efficiency.

Richard Bonner, chief technology officer at Accelsius, stated, “This project provides a bigger stage to showcase the advancements we’ve made in two-phase cooling and to push the envelope on what’s possible for future data center efficiency.”